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Rainer Minixhofer Coauthor index pubzone.org

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DBLP keys2010
6Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLStanislav Tyaginov, Ivan Starkov, Oliver Triebl, Johann Cervenka, C. Jungemann, S. Carniello, J. M. Park, Hubert Enichlmair, Markus Karner, Ch. Kernstock, E. Seebacher, Rainer Minixhofer, Hajdin Ceric, Tibor Grasser: Interface traps density-of-states as a vital component for hot-carrier degradation modeling. Microelectronics Reliability 50(9-11): 1267-1272 (2010)
2008
5Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLM. Schrems, M. Knaipp, Hubert Enichlmair, V. Vescoli, Rainer Minixhofer, E. Seebacher, F. Leisenberger, E. Wachmann, G. Schatzberger, H. Gensinger: Scalable High Voltage CMOS technology for Smart Power and sensor applications. Elektrotechnik und Informationstechnik 125(4): 109-117 (2008)
2007
4Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLRobert Entner, Tibor Grasser, Oliver Triebl, Hubert Enichlmair, Rainer Minixhofer: Negative bias temperature instability modeling for high-voltage oxides at different stress temperatures. Microelectronics Reliability 47(4-5): 697-699 (2007)
3Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLHubert Enichlmair, S. Carniello, J. M. Park, Rainer Minixhofer: Analysis of hot carrier effects in a 0.35 µm high voltage n-channel LDMOS transistor. Microelectronics Reliability 47(9-11): 1439-1443 (2007)
2006
2Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLFederico Baronti, Paolo D'Abramo, M. Knaipp, Rainer Minixhofer, Roberto Roncella, Roberto Saletti, M. Schrems, Riccardo Serventi, V. Vescoli: FlexRay transceiver in a 0.35 µm CMOS high-voltage technology. DATE Designers' Forum 2006: 201-205
2004
1Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLStefan Holzer, Rainer Minixhofer, Clemens Heitzinger, Johannes Fellner, Tibor Grasser, Siegfried Selberherr: Extraction of material parameters based on inverse modeling of three-dimensional interconnect fusing structures. Microelectronics Journal 35(10): 805-810 (2004)

Coauthor Index

1Federico Baronti [2]
2S. Carniello [3] [6]
3Hajdin Ceric [6]
4Johann Cervenka [6]
5Paolo D'Abramo [2]
6Hubert Enichlmair [3] [4] [5] [6]
7Robert Entner [4]
8Johannes Fellner [1]
9H. Gensinger [5]
10Tibor Grasser [1] [4] [6]
11Clemens Heitzinger [1]
12Stefan Holzer [1]
13C. Jungemann [6]
14Markus Karner [6]
15Ch. Kernstock [6]
16M. Knaipp [2] [5]
17F. Leisenberger [5]
18J. M. Park [3] [6]
19Roberto Roncella [2]
20Roberto Saletti [2]
21G. Schatzberger [5]
22M. Schrems [2] [5]
23E. Seebacher [5] [6]
24Siegfried Selberherr [1]
25Riccardo Serventi [2]
26Ivan Starkov [6]
27Oliver Triebl [4] [6]
28Stanislav Tyaginov [6]
29V. Vescoli [2] [5]
30E. Wachmann [5]

Last update Mon Jun 4 20:40:43 2012 CET by the DBLP TeamThis material is Open Data Data released under the ODC-BY 1.0 license — See also our legal information page