 | 2009 |
| 3 |  | Christopher Mineo,
William Rhett Davis:
The benefits of 3D networks-on-chip as shown with LDPC decoding.
3DIC 2009: 1-8 |
| 2006 |
| 2 |  | Hao Hua,
Christopher Mineo,
Kory Schoenfliess,
Ambarish M. Sule,
Samson Melamed,
Ravi Jenkal,
W. Rhett Davis:
Exploring compromises among timing, power and temperature in three-dimensional integrated circuits.
DAC 2006: 997-1002 |
| 2005 |
| 1 |  | W. Rhett Davis,
John Wilson,
Stephen Mick,
Jian Xu,
Hao Hua,
Christopher Mineo,
Ambarish M. Sule,
Michael B. Steer,
Paul D. Franzon:
Demystifying 3D ICs: The Pros and Cons of Going Vertical.
IEEE Design & Test of Computers 22(6): 498-510 (2005) |