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Bruno Michel Coauthor index pubzone.org

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DBLP keys2012
10Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLPatrick Ruch, Thomas Brunschwiler, Werner Escher, Stephan Paredes, Bruno Michel: Bionic Packaging: A Promising Paradigm for Future Computing. ERCIM News 2012(89): (2012)
2011
9Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLMohamed M. Sabry, Arvind Sridhar, David Atienza, Yuksel Temiz, Yusuf Leblebici, S. Szczukiewicz, N. Borhani, J. R. Thome, Thomas Brunschwiler, Bruno Michel: Towards thermally-aware design of 3D MPSoCs with inter-tier cooling. DATE 2011: 1466-1471
8Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLPatrick Ruch, Thomas Brunschwiler, Werner Escher, Stephan Paredes, Bruno Michel: Toward five-dimensional scaling: How density improves efficiency in future computers. IBM Journal of Research and Development 55(5): 15 (2011)
2010
7Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLAyse Kivilcim Coskun, David Atienza, Tajana Simunic Rosing, Thomas Brunschwiler, Bruno Michel: Energy-efficient variable-flow liquid cooling in 3D stacked architectures. DATE 2010: 111-116
2009
6Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLThomas Brunschwiler, Stephan Paredes, Ute Drechsler, Bruno Michel, W. Cesar, G. Toral, Yuksel Temiz, Yusuf Leblebici: Validation of the porous-medium approach to model interlayer-cooled 3D-chip stacks. 3DIC 2009: 1-10
5Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLGerhard Ingmar Meijer, Thomas Brunschwiler, Stephan Paredes, Bruno Michel: Using Waste Heat from Data Centres to Minimize Carbon Dioxide Emission. ERCIM News 2009(79): (2009)
4Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLThomas Brunschwiler, Brian Smith, E. Ruetsche, Bruno Michel: Toward zero-emission data centers through direct reuse of thermal energy. IBM Journal of Research and Development 53(3): 11 (2009)
3Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLBrian Smith, Thomas Brunschwiler, Bruno Michel: Comparison of transient and static test methods for chip-to-sink thermal interface characterization. Microelectronics Journal 40(9): 1379-1386 (2009)
2001
2Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLBruno Michel, André Bernard, Alexander Bietsch, Emmanuel Delamarche, Matthias Geissler, David Juncker, Hannes Kind, Jean-Philippe Renault, Hugo E. Rothuizen, Heinz Schmid, Patrick Schmidt-Winkel, Richard Stutz, Heiko Wolf: Printing meets lithography: Soft approaches to high-resolution patterning. IBM Journal of Research and Development 45(5): 697- (2001)
1997
1Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLHans A. Biebuyck, Niels B. Larsen, Emmanuel Delamarche, Bruno Michel: Lithography beyond light: Microcontact printing with monolayer resists. IBM Journal of Research and Development 41(1&2): 159-170 (1997)

Coauthor Index

1David Atienza (David Atienza Alonso) [7] [9]
2André Bernard [2]
3Hans A. Biebuyck [1]
4Alexander Bietsch [2]
5N. Borhani [9]
6Thomas Brunschwiler [3] [4] [5] [6] [7] [8] [9] [10]
7W. Cesar [6]
8Ayse Kivilcim Coskun [7]
9Emmanuel Delamarche [1] [2]
10Ute Drechsler [6]
11Werner Escher [8] [10]
12Matthias Geissler [2]
13David Juncker [2]
14Hannes Kind [2]
15Niels B. Larsen [1]
16Yusuf Leblebici [6] [9]
17Gerhard Ingmar Meijer [5]
18Stephan Paredes [5] [6] [8] [10]
19Jean-Philippe Renault [2]
20Hugo E. Rothuizen [2]
21Patrick Ruch [8] [10]
22E. Ruetsche [4]
23Mohamed M. Sabry [9]
24Heinz Schmid [2]
25Patrick Schmidt-Winkel [2]
26Tajana Simunic (Tajana Simunic Rosing) [7]
27Brian Smith [3] [4]
28Arvind Sridhar [9]
29Richard Stutz [2]
30S. Szczukiewicz [9]
31Yuksel Temiz [6] [9]
32J. R. Thome [9]
33G. Toral [6]
34Heiko Wolf [2]

Last update Mon Jun 4 20:40:43 2012 CET by the DBLP TeamThis material is Open Data Data released under the ODC-BY 1.0 license — See also our legal information page