 | 2011 |
|---|
| 12 |       | J. Lee,
M. Mayer,
Y. Zhou,
J. T. Moon,
J. Persic:
Influence of gold pick up on the hardness of copper free air ball.
Microelectronics Reliability 51(1): 30-37 (2011) |
| 11 | | J. Lee,
M. Mayer,
Y. Zhou,
S. J. Hong,
J. T. Moon:
Silver pick up during tail formation in thermosonic wire bonding process.
Microelectronics Reliability 51(1): 38-42 (2011) |
| 10 | | A. Pequegnat,
H. J. Kim,
M. Mayer,
Y. Zhou,
J. Persic,
J. T. Moon:
Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding.
Microelectronics Reliability 51(1): 43-52 (2011) |
| 9 | | I. Qin,
A. Shah,
C. Huynh,
M. Meyer,
M. Mayer,
Y. Zhou:
Role of process parameters on bondability and pad damage indicators in copper ball bonding.
Microelectronics Reliability 51(1): 60-66 (2011) |
| 8 | | A. Shah,
A. Rezvani,
M. Mayer,
Y. Zhou,
J. Persic,
J. T. Moon:
Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding.
Microelectronics Reliability 51(1): 67-74 (2011) |
| 2009 |
|---|
| 7 | | M. Mayer,
J. T. Moon,
J. Persic:
Measuring stress next to Au ball bond during high temperature aging.
Microelectronics Reliability 49(7): 771-781 (2009) |
| 2008 |
|---|
| 6 | | Fritz Paschke,
W. Ehrlich-Schupita,
M. Mayer:
Design of a Brewster-angle broad-band waveguide window with ghost-mode suppression for the Ku-band.
Elektrotechnik und Informationstechnik 125(5): 197-201 (2008) |
| 5 | | J. Lee,
M. Mayer,
Y. Zhou,
S. J. Hong:
Erratum to "Iterative optimization of tail breaking force of 1 mil wire thermosonic ball bonding processes and the influence of plasma cleaning": [Microelectronics Journal 38 (2007) 842-847].
Microelectronics Journal 39(2): 299 (2008) |
| 4 | | C. J. Hang,
C. Q. Wang,
M. Mayer,
Y. H. Tian,
Y. Zhou,
H. H. Wang:
Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging.
Microelectronics Reliability 48(3): 416-424 (2008) |
| 2007 |
|---|
| 3 | | J. Lee,
M. Mayer,
Y. Zhou,
S. J. Hong:
Iterative optimization of tail breaking force of 1mil wire thermosonic ball bonding processes and the influence of plasma cleaning.
Microelectronics Journal 38(8-9): 842-847 (2007) |
| 2004 |
|---|
| 2 | | A. Barletta,
M. Mayer,
B. Moser:
Leafing digital content.
IUI 2004: 217-219 |
| 1994 |
|---|
| 1 |  | Thomas Norgall,
M. Mayer,
G. Hergenröder:
Übergang zwischen ISO/OSI-Anwendungsprotokollen X.400 und MAP MMS für eine KKS-Laboranbindung.
GMDS 1994: 85-87 |
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