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| 2008 | ||
|---|---|---|
| 3 | F. N. Masana: Thermal impedance measurements under non-equilibrium conditions. How to extend its validity. Microelectronics Reliability 48(4): 563-568 (2008) | |
| 2007 | ||
| 2 | F. N. Masana: A straightforward analytical method for extraction of semiconductor device transient thermal parameters. Microelectronics Reliability 47(12): 2122-2128 (2007) | |
| 2001 | ||
| 1 | F. N. Masana: A new approach to the dynamic thermal modelling of semiconductor packages. Microelectronics Reliability 41(6): 901-912 (2001) | |
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