J. Maria

	2008
1		Katsuyuki Sakuma, Paul S. Andry, Cornelia K. Tsang, Steven L. Wright, Bing Dang, Chirag S. Patel, Bucknell C. Webb, J. Maria, Edmund J. Sprogis, S. K. Kang, Robert J. Polastre, Raymond R. Horton, John U. Knickerbocker: 3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. IBM Journal of Research and Development 52(6): 611-622 (2008)

Coauthor Index

1	Paul S. Andry	[1]
2	Bing Dang	[1]
3	Raymond R. Horton	[1]
4	S. K. Kang	[1]
5	John U. Knickerbocker	[1]
6	Chirag S. Patel	[1]
7	Robert J. Polastre	[1]
8	Katsuyuki Sakuma	[1]
9	Edmund J. Sprogis	[1]
10	Cornelia K. Tsang	[1]
11	Bucknell C. Webb	[1]
12	Steven L. Wright	[1]

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