Ted Lundquist

	2011
12		Cathy Kardach, I. Kapilevich, J. Block, Ted Lundquist, Steven Kasapi, J. Liao, Yin S. Ng, Bruce Cory: Foundry workflow for dynamic-EFA-based yield ramp. Microelectronics Reliability 51(9-11): 1668-1672 (2011)
	2010
11		P. Scholz, C. Gallrapp, Uwe Kerst, Ted Lundquist, Christian Boit: Optimizing focused ion beam created solid immersion lenses in bulk silicon using design of experiments. Microelectronics Reliability 50(9-11): 1441-1445 (2010)
10		Rudolf Schlangen, Hervé Deslandes, Ted Lundquist, C. Schmidt, F. Altmann, K. Yu, A. Andreasyan, S. Li: Dynamic lock-in thermography for operation mode-dependent thermally active fault localization. Microelectronics Reliability 50(9-11): 1454-1458 (2010)
	2009
9		Joy Y. Liao, Tung Ton, Nathan Slattengren, Steven Kasapi, William K. Lo, Howard L. Marks, Yin S. Ng, Ted Lundquist: Jitter analysis of PLL-generated clock propagation using Jitter Mitigation techniques with laser voltage probing. Microelectronics Reliability 49(9-11): 1127-1131 (2009)
8		Rudolf Schlangen, Reiner Leihkauf, Uwe Kerst, Ted Lundquist, Peter Egger, Christian Boit: Physical analysis, trimming and editing of nanoscale IC function with backside FIB processing. Microelectronics Reliability 49(9-11): 1158-1164 (2009)
	2008
7		Christian Boit, Rudolf Schlangen, Uwe Kerst, Ted Lundquist: Physical Techniques for Chip-Backside IC Debug in Nanotechnologies. IEEE Design & Test of Computers 25(3): 250-257 (2008)
	2007
6		Rudolf Schlangen, Reiner Leihkauf, Uwe Kerst, Christian Boit, Rajesh Jain, Tahir Malik, Keneth R. Wilsher, Ted Lundquist, Bernd Krüger: Backside E-Beam Probing on Nano scale devices. ITC 2007: 1-9
5		Rudolf Schlangen, Uwe Kerst, Christian Boit, Tahir Malik, Rajesh Jain, Ted Lundquist: Non destructive 3D chip inspection with nano scale potential by use of backside FIB and backscattered electron microscopy. Microelectronics Reliability 47(9-11): 1523-1528 (2007)
	2005
4		Uwe Kerst, Rudolf Schlangen, A. Kabakow, Erwan Le Roy, Ted Lundquist, Siegfried Pauthner: Impact of back side circuit edit on active device performance in bulk silicon ICs. ITC 2005: 9
	2003
3		Romain Desplats, Felix Beaudoin, Philippe Perdu, Nagamani Nataraj, Ted Lundquist, Ketan Shah: Fault Localization using Time Resolved Photon Emission and STIL Waveforms. ITC 2003: 254-263
	2002
2		Chun-Cheng Tsao, Bill Thompson, Ted Lundquist: Imaging and Material Analysis from Sputter-Induced Light Emission Using Coaxial Ion-Photon Column. Microelectronics Reliability 42(9-11): 1667-1672 (2002)
	2001
1		G. Dajee, N. Goldblatt, Ted Lundquist, Steven Kasapi, Keneth R. Wilsher: Practical, non-invasive optical probing for flip-chip devices. ITC 2001: 433-442

Coauthor Index

1	F. Altmann	[10]
2	A. Andreasyan	[10]
3	Felix Beaudoin	[3]
4	J. Block	[12]
5	Christian Boit	[5] [6] [7] [8] [11]
6	Bruce Cory	[12]
7	G. Dajee	[1]
8	Hervé Deslandes	[10]
9	Romain Desplats	[3]
10	Peter Egger	[8]
11	C. Gallrapp	[11]
12	N. Goldblatt	[1]
13	Rajesh Jain	[5] [6]
14	A. Kabakow	[4]
15	I. Kapilevich	[12]
16	Cathy Kardach	[12]
17	Steven Kasapi	[1] [9] [12]
18	Uwe Kerst	[4] [5] [6] [7] [8] [11]
19	Bernd Krüger	[6]
20	Reiner Leihkauf	[6] [8]
21	S. Li	[10]
22	J. Liao	[12]
23	Joy Y. Liao	[9]
24	William K. Lo	[9]
25	Tahir Malik	[5] [6]
26	Howard L. Marks	[9]
27	Nagamani Nataraj	[3]
28	Yin S. Ng	[9] [12]
29	Siegfried Pauthner	[4]
30	Philippe Perdu	[3]
31	Erwan Le Roy	[4]
32	Rudolf Schlangen	[4] [5] [6] [7] [8] [10]
33	C. Schmidt	[10]
34	P. Scholz	[11]
35	Ketan Shah	[3]
36	Nathan Slattengren	[9]
37	Bill Thompson	[2]
38	Tung Ton	[9]
39	Chun-Cheng Tsao	[2]
40	Keneth R. Wilsher	[1] [6]
41	K. Yu	[10]

Colors in the list of coauthors

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