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Hua Lu Coauthor index pubzone.org

Ryerson University, Toronto, Canada

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DBLP keys2006
2Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLHua Lu, Helen Shi, Ming Zhou: Thermally induced deformation of solder joints in real packages: Measurement and analysis. Microelectronics Reliability 46(7): 1148-1159 (2006)
2005
1Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLHua Lu, Jesse Zhou, Rich Golek, Ming Zhou: Hybrid reliability assessment for packaging prototyping. Microelectronics Reliability 45(3-4): 597-609 (2005)

Coauthor Index

1Rich Golek [1]
2Helen Shi [2]
3Jesse Zhou [1]
4Ming Zhou [1] [2]

Last update Mon Jun 4 20:40:43 2012 CET by the DBLP TeamThis material is Open Data Data released under the ODC-BY 1.0 license — See also our legal information page