Xingsheng Liu

	2005
4		Y. C. Lin, X. Chen, Xingsheng Liu, Guo-Quan Lu: Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling. Microelectronics Reliability 45(1): 143-154 (2005)
	2002
3		Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard: Effect of substrate flexibility on solder joint reliability. Microelectronics Reliability 42(12): 1883-1891 (2002)
	2001
2		Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard: Stacked solder bumping technology for improved solder joint reliability. Microelectronics Reliability 41(12): 1979-1992 (2001)
1		Shatil Haque, Kalyan Siddabattula, Mike Craven, Sihua Wen, Xingsheng Liu, Dusan Boroyevich, Guo-Quan Lu: Design issues of a three-dimensional packaging scheme for power modules. Microelectronics Reliability 41(2): 295-305 (2001)

Coauthor Index

1	Dusan Boroyevich	[1]
2	X. Chen	[4]
3	Mike Craven	[1]
4	David A. Dillard	[2] [3]
5	Shatil Haque	[1]
6	Y. C. Lin	[4]
7	Guo-Quan Lu	[1] [2] [3] [4]
8	Kalyan Siddabattula	[1]
9	Sihua Wen	[1]
10	Shuangyan Xu	[2] [3]

Last update Sun Jun 3 16:06:10 2012 CET by the DBLP Team — Data released under the ODC-BY 1.0 license — See also our legal information page