Paul Lindler

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2008

1 Herwig Kirchberger, Paul Lindler, Markus Wimplinger: Novel Bonding technologies for wafer-level transparent packaging of MOEMS CoRR abs/0802.3103: (2008)

	2008
1		Herwig Kirchberger, Paul Lindler, Markus Wimplinger: Novel Bonding technologies for wafer-level transparent packaging of MOEMS CoRR abs/0802.3103: (2008)

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