T. Y. Lin

	2010
16		Zehua Chen, T. Y. Lin: Matrix Theory for Tolerance Granular Computing. GrC 2010: 673-676
	2007
15		Xinying Xu, Gaowei Yan, Keming Xie, T. Y. Lin: Immune Evolution Algorithm Based Dynamic Path Planning Approach for the Soccer Robot. GrC 2007: 477-480
14		Jun Xie, Gaowei Yan, Keming Xie, T. Y. Lin: Neuro-Fuzzy Model-Based CUSUM Method Application in Fault Detection on an Autonomous Vehicle. GrC 2007: 548-551
13		T. Y. Lin: Granular Computing and Web Processing: Representing Documents in Polyhedron. GrC 2007: 6
12		Jianchao Han, T. Y. Lin, Jiye Li, Nick Cercone: Constructing Associative Classifiers from Decision Tables. RSFDGrC 2007: 305-313
	2005
11		Priya Baliga, T. Y. Lin: Kolmogorov complexity based automata modeling for intrusion detection. GrC 2005: 387-392
10		Churn-Jung Liau, T. Y. Lin: Reasoning about relational granulation in modal logics. GrC 2005: 530-534
9		Wesley W. Chu, T. Y. Lin: Introduction. Appl. Intell. 22(1): 7 (2005)
8		Y. F. Yao, B. Njoman, K. H. Chua, T. Y. Lin: New encapsulation development for fine pitch IC devices. Microelectronics Reliability 45(7-8): 1222-1229 (2005)
	2004
7		T. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma: The impact of moisture in mold compound preforms on the warpage of PBGA packages. Microelectronics Reliability 44(4): 603-609 (2004)
	2003
6		Y. F. Yao, T. Y. Lin, K. H. Chua: Improving the deflection of wire bonds in stacked chip scale package (CSP). Microelectronics Reliability 43(12): 2039-2045 (2003)
5		T. Y. Lin, K. L. Davison, W. S. Leong, Simon Chua, Y. F. Yao, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu: Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages. Microelectronics Reliability 43(5): 803-809 (2003)
4		T. Y. Lin, C. M. Fang, Y. F. Yao, K. H. Chua: Development of the green plastic encapsulation for high density wirebonded leaded packages. Microelectronics Reliability 43(5): 811-817 (2003)
	2002
3		T. Y. Lin, W. S. Leong, K. H. Chua, R. Oh, Y. Miao, J. S. Pan, J. W. Chai: The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method. Microelectronics Reliability 42(3): 375-380 (2002)
	2001
2		T. Y. Lin, Vladik Kreinovich: A Special Session on Granular Computing and Interval Computations at the 19th International Conference of the North American Fuzzy Information Processing Society (NAFIPS) Atlanta, Georgia, July 13-15, 2000. Reliable Computing 7(1): 71-72 (2001)
	1988
1		T. Y. Lin: Neighborhood systems and relational databases. ACM Conference on Computer Science 1988: 725

Coauthor Index

1	Priya Baliga	[11]
2	Nick Cercone	[12]
3	J. W. Chai	[3] [5]
4	Zehua Chen	[16]
5	Wesley W. Chu	[9]
6	K. H. Chua	[3] [4] [6] [7] [8]
7	Simon Chua	[5]
8	D. Crouthamel	[7]
9	K. L. Davison	[5]
10	C. M. Fang	[4]
11	Jianchao Han	[12]
12	Vladik Kreinovich	[2]
13	W. S. Leong	[3] [5]
14	Jiye Li	[12]
15	Churn-Jung Liau	[10]
16	Y. Y. Ma	[7]
17	Y. Miao	[3]
18	B. Njoman	[7] [8]
19	R. Oh	[3]
20	J. S. Pan	[3] [5]
21	S. Y. Teo	[7]
22	W. C. Tjiu	[5]
23	K. C. Toh	[5]
24	Jun Xie	[14]
25	Keming Xie	[14] [15]
26	Xinying Xu	[15]
27	Gaowei Yan	[14] [15]
28	Y. F. Yao	[4] [5] [6] [8]

Colors in the list of coauthors

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