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| 2011 | ||
|---|---|---|
| 2 | Tong An, Fei Qin, Jiangang Li: Mechanical behavior of solder joints under dynamic four-point impact bending. Microelectronics Reliability 51(5): 1011-1019 (2011) | |
| 2007 | ||
| 1 | Yunjiang Lou, Jiangang Li, Jinbo Shi, Zexiang Li: Development of a Novel 3-DoF Purely Translational Parallel Mechanism. ICRA 2007: 169-174 | |
| 1 | Tong An | [2] |
| 2 | Zexiang Li | [1] |
| 3 | Yunjiang Lou | [1] |
| 4 | Fei Qin | [2] |
| 5 | Jinbo Shi | [1] |
Colors in the list of coauthors
Last update Sun Jun 3 16:06:10 2012 CET by the DBLP Team —
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