 | 2012 |
| 9 |  | Young-Joon Lee,
Sung Kyu Lim:
Fast delay estimation with buffer insertion for through-silicon-via-based 3D interconnects.
ISQED 2012: 228-335 |
| 8 |  | Dae Hyun Kim,
Krit Athikulwongse,
Michael B. Healy,
Mohammad Hossain,
Moongon Jung,
Ilya Khorosh,
Gokul Kumar,
Young-Joon Lee,
Dean L. Lewis,
Tzu-Wei Lin,
Chang Liu,
Shreepad Panth,
Mohit Pathak,
Minzhen Ren,
Guanhao Shen,
Taigon Song,
Dong Hyuk Woo,
Xin Zhao,
Joungho Kim,
Ho Choi,
Gabriel H. Loh,
Hsien-Hsin S. Lee,
Sung Kyu Lim:
3D-MAPS: 3D Massively parallel processor with stacked memory.
ISSCC 2012: 188-190 |
| 2011 |
| 7 |  | Young-Joon Lee,
Sung Kyu Lim:
Co-Optimization and Analysis of Signal, Power, and Thermal Interconnects in 3-D ICs.
IEEE Trans. on CAD of Integrated Circuits and Systems 30(11): 1635-1648 (2011) |
| 2010 |
| 6 |  | Young-Joon Lee,
Sung Kyu Lim:
Timing analysis and optimization for 3D stacked multi-core microprocessors.
3DIC 2010: 1-7 |
| 5 |  | Michael B. Healy,
Krit Athikulwongse,
Rohan Goel,
Mohammed M. Hossain,
Dae Hyun Kim,
Young-Joon Lee,
Dean L. Lewis,
Tzu-Wei Lin,
Chang Liu,
Moongon Jung,
Brian Ouellette,
Mohit Pathak,
Hemant Sane,
Guanhao Shen,
Dong Hyuk Woo,
Xin Zhao,
Gabriel H. Loh,
Hsien-Hsin S. Lee,
Sung Kyu Lim:
Design and analysis of 3D-MAPS: A many-core 3D processor with stacked memory.
CICC 2010: 1-4 |
| 4 |  | Jae-Seok Yang,
Krit Athikulwongse,
Young-Joon Lee,
Sung Kyu Lim,
David Z. Pan:
TSV stress aware timing analysis with applications to 3D-IC layout optimization.
DAC 2010: 803-806 |
| 3 |  | Mohit Pathak,
Young-Joon Lee,
Thomas Moon,
Sung Kyu Lim:
Through-silicon-via management during 3D physical design: When to add and how many?
ICCAD 2010: 387-394 |
| 2009 |
| 2 |  | Young-Joon Lee,
Yoon Jo Kim,
Gang Huang,
Muhannad Bakir,
Yogendra Joshi,
Andrei Fedorov,
Sung Kyu Lim:
Co-design of signal, power, and thermal distribution networks for 3D ICs.
DATE 2009: 610-615 |
| 1 |  | Young-Joon Lee,
Rohan Goel,
Sung Kyu Lim:
Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs.
ICCAD 2009: 645-651 |