Yao-Jung Lee

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2005

1 Cho-Liang Chung, Liang-Tien Lu, Yao-Jung Lee: Influence of halogen-free compound and lead-free solder paste on on-board reliability of green CSP (chip scale package). Microelectronics Reliability 45(12): 1916-1923 (2005)

	2005
1		Cho-Liang Chung, Liang-Tien Lu, Yao-Jung Lee: Influence of halogen-free compound and lead-free solder paste on on-board reliability of green CSP (chip scale package). Microelectronics Reliability 45(12): 1916-1923 (2005)

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