Kang Wook Lee

	2011
11		Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi: Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration. Micromachines 2(1): 49-68 (2011)
	2010
10		Kouji Kiyoyama, Kang Wook Lee, Takafumi Fukushima, H. Naganuma, Hiroaki Kobayashi, Tetsu Tanaka, Mitsumasa Koyanagi: A block-parallel signal processing system for CMOS image sensor with three-dimensional structure. 3DIC 2010: 1-4
9		Akihiro Noriki, Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi: Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI. 3DIC 2010: 1-4
8		Takafumi Fukushima, Eiji Iwata, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi: Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature. 3DIC 2010: 1-5
7		Mariappan Murugesan, Yuki Ohara, Jichoel Bea, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi: Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding. 3DIC 2010: 1-5
	2009
6		Yoshiyuki Kaiho, Yuki Ohara, Hirotaka Takeshita, Kouji Kiyoyama, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi: 3D integration technology for 3D stacked retinal chip. 3DIC 2009: 1-4
5		Kouji Kiyoyama, Yuki Ohara, Kang Wook Lee, Y. Yang, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi: A parallel ADC for high-speed CMOS image processing system with 3D structure. 3DIC 2009: 1-4
4		Ji Chel Bea, Mariappan Murugesan, Yuki Ohara, Akihiro Noriki, Hisaski Kino, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi: Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration. 3DIC 2009: 1-5
3		Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma, Kang Wook Lee, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi: 10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack. 3DIC 2009: 1-6
2		Kang Wook Lee, Shigeyuki Kanno, Yuki Ohara, Kouji Kiyoyama, Ji Chel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi: Heterogeneous integration technology for MEMS-LSI multi-chip module. 3DIC 2009: 1-6
	2000
1		Hiroyuki Kurino, M. Nakagawa, Kang Wook Lee, Tomonori Nakamura, Yuusuke Yamada, Ki Tae Park, Mitsumasa Koyanagi: Smart Vision Chip Fabricated Using Three Dimensional Integration Technology. NIPS 2000: 720-726

Coauthor Index

1	Ji Chel Bea	[2] [4] [11]
2	Jichoel Bea	[3] [7] [8] [9]
3	Takafumi Fukushima	[2] [3] [4] [5] [7] [8] [9] [10] [11]
4	Eiji Iwata	[8] [11]
5	Yoshiyuki Kaiho	[6]
6	Shigeyuki Kanno	[2]
7	Hisaski Kino	[4]
8	Kouji Kiyoyama	[2] [5] [6] [10]
9	Hiroaki Kobayashi	[10]
10	Risato Kobayashi	[11]
11	Toshiya Kojima	[11]
12	Takayuki Konno	[11]
13	Mitsumasa Koyanagi	[1] [2] [3] [4] [5] [6] [7] [8] [9] [10] [11]
14	Hiroyuki Kurino	[1]
15	Mariappan Murugesan	[3] [4] [7] [8] [11]
16	H. Naganuma	[10]
17	M. Nakagawa	[1]
18	Tomonori Nakamura	[1]
19	Akihiro Noriki	[3] [4] [9]
20	Yuki Ohara	[2] [3] [4] [5] [6] [7]
21	Ki Tae Park	[1]
22	Katsuyuki Sakuma	[3]
23	Hirotaka Takeshita	[6]
24	Tetsu Tanaka	[2] [3] [4] [5] [6] [7] [8] [9] [10] [11]
25	Fumiaki Yamada	[3]
26	Yuusuke Yamada	[1]
27	Y. Yang	[5]

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