| | |
- CSB - MetaPress - Google - Bing - Yahoo
 | 2009 | |
|---|---|---|
| 2 |      | Michael Hertl, Diane Weidmann, Jean-Claude Lecomte: An advanced quality and reliability assessment approach applied to thermal stress issues in electronic components and assemblies. Microelectronics Reliability 49(9-11): 1148-1152 (2009) |
| 2005 | ||
| 1 | | Isaline Richard, Romain Fayolle, Jean-Claude Lecomte: New experimental approach for failure prediction in electronics: Topography and deformation measurement complemented with acoustic microscopy. Microelectronics Reliability 45(9-11): 1645-1651 (2005) |
| 1 | Romain Fayolle | [1] |
| 2 | Michael Hertl | [2] |
| 3 | Isaline Richard | [1] |
| 4 | Diane Weidmann | [2] |
Colors in the list of coauthors
Last update Sun Jun 3 16:06:10 2012 CET by the DBLP Team —
Data released under the ODC-BY 1.0 license — See also our legal information page