Hideki Kusamitsu

	2011
4		Katsuyuki Ikeuchi, Hideki Kusamitsu, Mutsuo Daito, Gil-Su Kim, Makoto Takamiya, Takayasu Sakurai: 1 Gb/s, 50 µm × 50 µm Pads on Board Wireless Connector Based on Track-and-Charge Scheme Allowing Contacted Signaling. IEICE Transactions 94-C(6): 992-998 (2011)
3		Mutsuo Daito, Yoshiro Nakata, Satoshi Sasaki, Hiroyuki Gomyo, Hideki Kusamitsu, Yoshio Komoto, Kunihiko Iizuka, Katsuyuki Ikeuchi, Gil-Su Kim, Makoto Takamiya, Takayasu Sakurai: Capacitively Coupled Non-Contact Probing Circuits for Membrane-Based Wafer-Level Simultaneous Testing. J. Solid-State Circuits 46(10): 2386-2395 (2011)
	2010
2		Mutsuo Daito, Yoshiro Nakata, Satoshi Sasaki, Hiroyuki Gomyo, Hideki Kusamitsu, Yoshio Komoto, Kunihiko Iizuka, Katsuyuki Ikeuchi, Gil-Su Kim, Makoto Takamiya, Takayasu Sakurai: Capacitively coupled non-contact probing circuits for membrane-based wafer-level simultaneous testing. ISSCC 2010: 144-145
	2007
1		Atsushi Hiraishi, Toshio Sugano, Hideki Kusamitsu: Preferable Improvements and Changes to FB-DiMM High-Speed Channel for 9.6Gbps Operation. ASP-DAC 2007: 841-845

Coauthor Index

1	Mutsuo Daito	[2] [3] [4]
2	Hiroyuki Gomyo	[2] [3]
3	Atsushi Hiraishi	[1]
4	Kunihiko Iizuka	[2] [3]
5	Katsuyuki Ikeuchi	[2] [3] [4]
6	Gil-Su Kim	[2] [3] [4]
7	Yoshio Komoto	[2] [3]
8	Yoshiro Nakata	[2] [3]
9	Takayasu Sakurai	[2] [3] [4]
10	Satoshi Sasaki	[2] [3]
11	Toshio Sugano	[1]
12	Makoto Takamiya	[2] [3] [4]

Colors in the list of coauthors

Last update Fri Jun 1 15:44:53 2012 CET by the DBLP Team — Data released under the ODC-BY 1.0 license — See also our legal information page