John U. Knickerbocker

	2012
11		Timothy O. Dickson, Yong Liu, Sergey V. Rylov, Bing Dang, Cornelia K. Tsang, Paul S. Andry, John F. Bulzacchelli, Herschel A. Ainspan, Xiaoxiong Gu, Lavanya Turlapati, Michael P. Beakes, Benjamin D. Parker, John U. Knickerbocker, Daniel J. Friedman: An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects. J. Solid-State Circuits 47(4): 884-896 (2012)
	2011
10		Paul W. Coteus, John U. Knickerbocker, Chung H. Lam, Yurii A. Vlasov: Technologies for exascale systems. IBM Journal of Research and Development 55(5): 14 (2011)
	2008
9		John U. Knickerbocker: Preface. IBM Journal of Research and Development 52(6): 539-540 (2008)
8		John U. Knickerbocker, Paul S. Andry, Bing Dang, Raymond R. Horton, Mario J. Interrante, Chirag S. Patel, Robert J. Polastre, Katsuyuki Sakuma, Ranjani Sirdeshmukh, Edmund J. Sprogis, Sri M. Sri-Jayantha, Antonio M. Stephens, Anna W. Topol, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright: Three-dimensional silicon integration. IBM Journal of Research and Development 52(6): 553-569 (2008)
7		Bing Dang, Steven L. Wright, Paul S. Andry, Edmund J. Sprogis, Cornelia K. Tsang, M. John Interrante, Bucknell C. Webb, Robert J. Polastre, Raymond R. Horton, Chirag S. Patel, Arun Sharma, J. Zheng, Katsuyuki Sakuma, John U. Knickerbocker: 3D chip stacking with C4 technology. IBM Journal of Research and Development 52(6): 599-609 (2008)
6		Katsuyuki Sakuma, Paul S. Andry, Cornelia K. Tsang, Steven L. Wright, Bing Dang, Chirag S. Patel, Bucknell C. Webb, J. Maria, Edmund J. Sprogis, S. K. Kang, Robert J. Polastre, Raymond R. Horton, John U. Knickerbocker: 3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. IBM Journal of Research and Development 52(6): 611-622 (2008)
5		Sri M. Sri-Jayantha, Gerald McVicker, Kerry Bernstein, John U. Knickerbocker: Thermomechanical modeling of 3D electronic packages. IBM Journal of Research and Development 52(6): 623-634 (2008)
	2005
4		John U. Knickerbocker, Paul S. Andry, L. Paivikki Buchwalter, Alina Deutsch, Raymond R. Horton, Keith A. Jenkins, Young Hoon Kwark, Gerald McVicker, Chirag S. Patel, Robert J. Polastre, Christian D. Schuster, Arun Sharma, Sri M. Sri-Jayantha, Christopher W. Surovic, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright, Samuel R. McKnight, Edmund J. Sprogis, Bing Dang: Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. IBM Journal of Research and Development 49(4-5): 725-754 (2005)
	2002
3		John U. Knickerbocker, Frank L. Pompeo, Alice F. Tai, Donald L. Thomas, Roger D. Weekly, Michael G. Nealon, Harvey C. Hamel, Anand Haridass, James N. Humenik, Richard A. Shelleman, Srinivasa N. Reddy, Kevin M. Prettyman, Benjamin V. Fasano, Sudipta K. Ray, Thomas E. Lombardi, Kenneth C. Marston, Patrick A. Coico, Peter J. Brofman, Lewis S. (Lew) Goldmann, David L. Edwards, Jeffrey A. Zitz, Sushumna Iruvanti, Subhash L. Shinde, Hai P. Longworth: An advanced multichip module (MCM) for high-performance UNIX servers. IBM Journal of Research and Development 46(6): 779-804 (2002)
	1992
2		Rao R. Tummala, John U. Knickerbocker, Sarah H. Knickerbocker, L. Wynn Herron, Robert W. Nufer, Raj N. Master, Mark O. Neisser, Benedikt M. Kellner, Charles H. Perry, James N. Humenik, Thomas F. Redmond: High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution. IBM Journal of Research and Development 36(5): 889-904 (1992)
	1991
1		John U. Knickerbocker, George B. Leung, William R. Miller, Steven P. Young, Scott A. Sands, Richard F. Indyk: IBM System/390 air-cooled alumina thermal conduction module. IBM Journal of Research and Development 35(3): 330-341 (1991)

Coauthor Index

1	Herschel A. Ainspan	[11]
2	Paul S. Andry	[4] [6] [7] [8] [11]
3	Michael P. Beakes	[11]
4	Kerry Bernstein	[5]
5	Peter J. Brofman	[3]
6	L. Paivikki Buchwalter	[4]
7	John F. Bulzacchelli	[11]
8	Patrick A. Coico	[3]
9	Paul W. Coteus	[10]
10	Bing Dang	[4] [6] [7] [8] [11]
11	Alina Deutsch	[4]
12	Timothy O. Dickson	[11]
13	David L. Edwards	[3]
14	Benjamin V. Fasano	[3]
15	Daniel J. Friedman	[11]
16	Lewis S. (Lew) Goldmann	[3]
17	Xiaoxiong Gu	[11]
18	Harvey C. Hamel	[3]
19	Anand Haridass	[3]
20	L. Wynn Herron	[2]
21	Raymond R. Horton	[4] [6] [7] [8]
22	James N. Humenik	[2] [3]
23	Richard F. Indyk	[1]
24	M. John Interrante	[7]
25	Mario J. Interrante	[8]
26	Sushumna Iruvanti	[3]
27	Keith A. Jenkins	[4]
28	S. K. Kang	[6]
29	Benedikt M. Kellner	[2]
30	Sarah H. Knickerbocker	[2]
31	Young Hoon Kwark	[4]
32	Chung H. Lam	[10]
33	George B. Leung	[1]
34	Yong Liu	[11]
35	Thomas E. Lombardi	[3]
36	Hai P. Longworth	[3]
37	J. Maria	[6]
38	Kenneth C. Marston	[3]
39	Raj N. Master	[2]
40	Samuel R. McKnight	[4]
41	Gerald McVicker	[4] [5]
42	William R. Miller	[1]
43	Michael G. Nealon	[3]
44	Mark O. Neisser	[2]
45	Robert W. Nufer	[2]
46	Benjamin D. Parker	[11]
47	Chirag S. Patel	[4] [6] [7] [8]
48	Charles H. Perry	[2]
49	Robert J. Polastre	[4] [6] [7] [8]
50	Frank L. Pompeo	[3]
51	Kevin M. Prettyman	[3]
52	Sudipta K. Ray	[3]
53	Srinivasa N. Reddy	[3]
54	Thomas F. Redmond	[2]
55	Sergey V. Rylov	[11]
56	Katsuyuki Sakuma	[6] [7] [8]
57	Scott A. Sands	[1]
58	Christian D. Schuster	[4]
59	Arun Sharma	[4] [7]
60	Richard A. Shelleman	[3]
61	Subhash L. Shinde	[3]
62	Ranjani Sirdeshmukh	[8]
63	Edmund J. Sprogis	[4] [6] [7] [8]
64	Sri M. Sri-Jayantha	[4] [5] [8]
65	Antonio M. Stephens	[8]
66	Christopher W. Surovic	[4]
67	Alice F. Tai	[3]
68	Donald L. Thomas	[3]
69	Anna W. Topol	[8]
70	Cornelia K. Tsang	[4] [6] [7] [8] [11]
71	Rao R. Tummala	[2]
72	Lavanya Turlapati	[11]
73	Yurii A. Vlasov	[10]
74	Bucknell C. Webb	[4] [6] [7] [8]
75	Roger D. Weekly	[3]
76	Steven L. Wright	[4] [6] [7] [8]
77	Steven P. Young	[1]
78	J. Zheng	[7]
79	Jeffrey A. Zitz	[3]

Colors in the list of coauthors

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