 | 2010 |
|---|
| 4 |       | Ladislav Andricek,
Michael Beimforde,
Armin Klumpp,
Anna Macchiolo,
Karl-Reinhard Merkel,
Hans-Günther Moser,
Richard Nisius,
Rainer Helmut Richter,
Josef Weber,
Philipp Weigell,
Robert Wieland:
Application of the SLID-ICV interconnection technology for the ATLAS pixel upgrade at SLHC.
3DIC 2010: 1-4 |
| 3 | | Harry Hedler,
Thomas Scheiter,
Markus Schieber,
Armin Klumpp,
Peter Ramm:
High performance 3D interconnects based on electrochemical etch and liquid metal fill.
3DIC 2010: 1-7 |
| 2 | | Armin Klumpp,
Peter Ramm,
Robert Wieland:
3D-integration of silicon devices: A key technology for sophisticated products.
DATE 2010: 1678-1683 |
| 2008 |
|---|
| 1 | | Jürgen Wolf,
Peter Ramm,
Armin Klumpp,
Herbert Reichl:
Technologies for 3D Heterogeneous Integration
CoRR abs/0805.0917: (2008) |
Data released under the ODC-BY 1.0 license — See also our legal information page