 | 2010 |
| 4 |  | Kouji Kiyoyama,
Kang Wook Lee,
Takafumi Fukushima,
H. Naganuma,
Hiroaki Kobayashi,
Tetsu Tanaka,
Mitsumasa Koyanagi:
A block-parallel signal processing system for CMOS image sensor with three-dimensional structure.
3DIC 2010: 1-4 |
| 2009 |
| 3 |  | Yoshiyuki Kaiho,
Yuki Ohara,
Hirotaka Takeshita,
Kouji Kiyoyama,
Kang Wook Lee,
Tetsu Tanaka,
Mitsumasa Koyanagi:
3D integration technology for 3D stacked retinal chip.
3DIC 2009: 1-4 |
| 2 |  | Kouji Kiyoyama,
Yuki Ohara,
Kang Wook Lee,
Y. Yang,
Takafumi Fukushima,
Tetsu Tanaka,
Mitsumasa Koyanagi:
A parallel ADC for high-speed CMOS image processing system with 3D structure.
3DIC 2009: 1-4 |
| 1 |  | Kang Wook Lee,
Shigeyuki Kanno,
Yuki Ohara,
Kouji Kiyoyama,
Ji Chel Bea,
Takafumi Fukushima,
Tetsu Tanaka,
Mitsumasa Koyanagi:
Heterogeneous integration technology for MEMS-LSI multi-chip module.
3DIC 2009: 1-6 |