 | 2012 |
|---|
| 7 |       | Toni T. Mattila,
Jue Li,
Jorma K. Kivilahti:
On the effects of temperature on the drop reliability of electronic component boards.
Microelectronics Reliability 52(1): 165-179 (2012) |
| 2010 |
|---|
| 6 | | Jussi Hokka,
Toni T. Mattila,
Jue Li,
Jarmo Teeri,
Jorma K. Kivilahti:
A novel impact test system for more efficient reliability testing.
Microelectronics Reliability 50(8): 1125-1133 (2010) |
| 2009 |
|---|
| 5 | | Tomi Laurila,
J. Hurtig,
V. Vuorinen,
Jorma K. Kivilahti:
Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu intermetallic compound layers.
Microelectronics Reliability 49(3): 242-247 (2009) |
| 2007 |
|---|
| 4 | | Marika P. Immonen,
Mikko Karppinen,
Jorma K. Kivilahti:
Investigation of environmental reliability of optical polymer waveguides embedded on printed circuit boards.
Microelectronics Reliability 47(2-3): 363-371 (2007) |
| 3 | | Tomi Laurila,
Toni T. Mattila,
V. Vuorinen,
J. S. Karppinen,
Jue Li,
M. Sippola,
Jorma K. Kivilahti:
Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests.
Microelectronics Reliability 47(7): 1135-1144 (2007) |
| 2005 |
|---|
| 2 | | Tuomas F. Waris,
Markus P. K. Turunen,
Tomi Laurila,
Jorma K. Kivilahti:
Evaluation of electrolessly deposited NiP integral resistors on flexible polyimide substrate.
Microelectronics Reliability 45(3-4): 665-673 (2005) |
| 2004 |
|---|
| 1 | | Markus P. K. Turunen,
Pekka Marjamäki,
Matti Paajanen,
Jouko Lahtinen,
Jorma K. Kivilahti:
Pull-off test in the assessment of adhesion at printed wiring board metallisation/epoxy interface.
Microelectronics Reliability 44(6): 993-1007 (2004) |
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