 | 2008 |
|---|
| 9 |       | Jeong-Won Yoon,
Hyun-Suk Chun,
Bo-In Noh,
Ja-Myeong Koo,
Jong-Woong Kim,
Hoo-Jeong Lee,
Seung-Boo Jung:
Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method.
Microelectronics Reliability 48(11-12): 1857-1863 (2008) |
| 8 | | Jeong-Won Yoon,
Bo-In Noh,
Young-Ho Lee,
Hyo-Soo Lee,
Seung-Boo Jung:
Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint.
Microelectronics Reliability 48(11-12): 1864-1874 (2008) |
| 7 | | Jong-Woong Kim,
Jin-Kyu Jang,
Sang-Ok Ha,
Sang-Su Ha,
Dae-Gon Kim,
Seung-Boo Jung:
Effect of high-speed loading conditions on the fracture mode of the BGA solder joint.
Microelectronics Reliability 48(11-12): 1882-1889 (2008) |
| 6 | | Bo-In Noh,
Jong-Bum Lee,
Seung-Boo Jung:
Effect of surface finish material on printed circuit board for electrochemical migration.
Microelectronics Reliability 48(4): 652-656 (2008) |
| 2007 |
|---|
| 5 | | Ja-Myeong Koo,
Seung-Boo Jung:
Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package
CoRR abs/0711.3306: (2007) |
| 4 | | Jeong-Won Yoon,
Hyun-Suk Chun,
Ja-Myeong Koo,
Seung-Boo Jung:
Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications
CoRR abs/0711.3323: (2007) |
| 3 | | Ja-Myeong Koo,
Seung-Boo Jung:
Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging.
Microelectronics Reliability 47(12): 2169-2178 (2007) |
| 2006 |
|---|
| 2 | | Jong-Woong Kim,
Dae-Gon Kim,
Seung-Boo Jung:
Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application.
Microelectronics Reliability 46(2-4): 535-542 (2006) |
| 1 | | Jeong-Won Yoon,
Seung-Boo Jung:
High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging.
Microelectronics Reliability 46(5-6): 905-914 (2006) |
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