Jinwon Joo

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2005

1 Jinwon Joo, Seungmin Cho, Bongtae Han: Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry. Microelectronics Reliability 45(3-4): 637-646 (2005)

	2005
1		Jinwon Joo, Seungmin Cho, Bongtae Han: Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry. Microelectronics Reliability 45(3-4): 637-646 (2005)

Coauthor Index

1 Seungmin Cho [1]

2 Bongtae Han [1]

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