![]() | ![]() |
| 2012 | ||
|---|---|---|
| 5 | Jongwon Lee, Duo Chen, Venkataramanan Balakrishnan, Cheng-Kok Koh, Dan Jiao: A Quadratic Eigenvalue Solver of Linear Complexity for 3-D Electromagnetics-Based Analysis of Large-Scale Integrated Circuits. IEEE Trans. on CAD of Integrated Circuits and Systems 31(3): 380-390 (2012) | |
| 2011 | ||
| 4 | Wenwen Chai, Dan Jiao: Direct matrix solution of linear complexity for surface integral-equation based impedance extraction of high bandwidth interconnects. DAC 2011: 206-211 | |
| 2009 | ||
| 3 | Wenwen Chai, Dan Jiao, Cheng-Kok Koh: A direct integral-equation solver of linear complexity for large-scale 3D capacitance and impedance extraction. DAC 2009: 752-757 | |
| 2 | Duo Chen, Dan Jiao: Time-Domain Orthogonal Finite-Element Reduction-Recovery Method for Electromagnetics-Based Analysis of Large-Scale Integrated Circuit and Package Problems. IEEE Trans. on CAD of Integrated Circuits and Systems 28(8): 1138-1149 (2009) | |
| 2007 | ||
| 1 | Houle Gan, Dan Jiao: A fast and high-capacity electromagnetic solution for highspeed IC design. ICCAD 2007: 1-6 | |
| 1 | Venkataramanan Balakrishnan | [5] |
| 2 | Wenwen Chai | [3] [4] |
| 3 | Duo Chen | [2] [5] |
| 4 | Houle Gan | [1] |
| 5 | Cheng-Kok Koh | [3] [5] |
| 6 | Jongwon Lee | [5] |
Colors in the list of coauthors
Last update Sun Jun 3 16:06:10 2012 CET by the DBLP Team —
Data released under the ODC-BY 1.0 license — See also our legal information page