John L. Jarvis

	2003
5		Thomas D. Moore, John L. Jarvis: Thermomechanical deformation of a bimaterial plate--as applied to laminate IC assemblies. Microelectronics Reliability 43(1): 155-162 (2003)
4		Thomas D. Moore, John L. Jarvis: A simple and fundamental design rule for resisting delamination in bimaterial structures. Microelectronics Reliability 43(3): 487-494 (2003)
3		Thomas D. Moore, John L. Jarvis: Erratum to "A simple and fundamental design rule for resisting delamination in bimaterial structures" [Microelectronics Reliability 2003;43: 487-494]. Microelectronics Reliability 43(7): 1169 (2003)
	2002
2		Thomas D. Moore, John L. Jarvis: The effects of in-plane orthotropic properties in a multi-chip ball grid array assembly. Microelectronics Reliability 42(6): 943-949 (2002)
	2001
1		Thomas D. Moore, John L. Jarvis: Improved reliability in small multichip ball grid arrays. Microelectronics Reliability 41(3): 461-469 (2001)

Coauthor Index

1

Thomas D. Moore

[1] [2] [3] [4] [5]

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