Paavo Jalonen

	2004
3		Teija Uusluoto, Paavo Jalonen, Harri Laaksonen, Aulis Tuominen: Metallization of microvias by sputter-deposition. Microelectronics Reliability 44(4): 587-593 (2004)
	2003
2		Paavo Jalonen: A new concept® for making fine line substrate for active component in polymer. Microelectronics Journal 34(2): 99-107 (2003)
	2002
1		Paavo Jalonen, Aulis Tuominen: The effect of sputtered interface metallic layers on reinforced core laminate making build-up structures. Microelectronics Reliability 42(7): 1075-1079 (2002)

Coauthor Index

1	Harri Laaksonen	[3]
2	Aulis Tuominen	[1] [3]
3	Teija Uusluoto	[3]

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