 | 2011 |
|---|
| 8 |       | Jochen Schuld,
Thilo Schäfer,
Stefan Nickel,
Peter Jacob,
Martin K. Schilling,
Sven Richter:
Impact of IT-supported clinical pathways on medical staff satisfaction. A prospective longitudinal cohort study.
I. J. Medical Informatics 80(3): 151-156 (2011) |
| 7 | | Peter Jacob:
From component to system failure analysis - The future challenge within work-sharing supply chains.
Microelectronics Reliability 51(9-11): 1618-1623 (2011) |
| 2009 |
|---|
| 6 | | Peter Jacob,
Willy Knecht,
Albert Kunz,
Giovanni Nicoletti,
Thomas Lautenschlager,
Moreno Mondada,
Damien Pachoud:
Reading distance degradation mechanisms of near-field RFID devices.
Microelectronics Reliability 49(9-11): 1288-1292 (2009) |
| 2008 |
|---|
| 5 | | Peter Jacob,
Werner Rothkirch:
Unusual defects, generated by wafer sawing: Diagnosis, mechanisms and how to distinguish from related failures.
Microelectronics Reliability 48(8-9): 1253-1257 (2008) |
| 4 | | Peter Jacob:
Surface ESD (ESDFOS) in assembly fab machineries as a functional and reliability risk - Failure analysis, tool diagnosis and on-site-remedies.
Microelectronics Reliability 48(8-9): 1608-1612 (2008) |
| 2007 |
|---|
| 3 | | Peter Jacob,
Giovanni Nicoletti,
Florian Hauf:
Device decapsulated (and/or depassivated) - Retest ok - What happened?
Microelectronics Reliability 47(9-11): 1574-1579 (2007) |
| 2006 |
|---|
| 2 | | Peter Jacob,
Albert Kunz,
Giovanni Nicoletti:
Reliability and wearout characterisation of LEDs.
Microelectronics Reliability 46(9-11): 1711-1714 (2006) |
| 2005 |
|---|
| 1 | | Peter Jacob,
Uwe Thiemann,
Joachim C. Reiner:
Electrostatic discharge directly to the chip surface, caused by automatic post-wafer processing.
Microelectronics Reliability 45(7-8): 1174-1180 (2005) |
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