Nikolai Iordanov

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2001

1 Valentin Videkov, Slavka Tzanova, Radosvet Arnaudov, Nikolai Iordanov: New assembling technique for BGA packages without thermal processes. Microelectronics Reliability 41(4): 611-615 (2001)

	2001
1		Valentin Videkov, Slavka Tzanova, Radosvet Arnaudov, Nikolai Iordanov: New assembling technique for BGA packages without thermal processes. Microelectronics Reliability 41(4): 611-615 (2001)

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