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| 2008 | ||
|---|---|---|
| 1 | Bing Dang, Steven L. Wright, Paul S. Andry, Edmund J. Sprogis, Cornelia K. Tsang, M. John Interrante, Bucknell C. Webb, Robert J. Polastre, Raymond R. Horton, Chirag S. Patel, Arun Sharma, J. Zheng, Katsuyuki Sakuma, John U. Knickerbocker: 3D chip stacking with C4 technology. IBM Journal of Research and Development 52(6): 599-609 (2008) | |
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