 | 2012 |
| 3 |  | Ademola Fawibe,
Jared Sherman,
Krishna Kavi,
Mike Ignatowski,
David Mayhew:
New Memory Organizations for 3D DRAM and PCMs.
ARCS 2012: 200-211 |
| 2008 |
| 2 |  | Syed M. Alam,
Mike Ignatowski,
Yuan Xie:
Technology, CAD tools, and designs for emerging 3D integration technology.
ACM Great Lakes Symposium on VLSI 2008: 1-2 |
| 2007 |
| 1 |  | Kerry Bernstein,
Paul Andry,
Jerome Cann,
Philip G. Emma,
David Greenberg,
Wilfried Haensch,
Mike Ignatowski,
Steven J. Koester,
John Magerlein,
Ruchir Puri,
Albert M. Young:
Interconnects in the Third Dimension: Design Challenges for 3D ICs.
DAC 2007: 562-567 |