 | 2008 |
|---|
| 3 |       | J. S. Hwang,
M. J. Yim,
K. W. Paik:
Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application.
Microelectronics Reliability 48(2): 293-299 (2008) |
| 2 | | J. S. Hwang:
Filler size and content effects on the composite properties of anisotropic conductive films (ACFs) and reliability of flip chip assembly using ACFs.
Microelectronics Reliability 48(4): 645-651 (2008) |
| 1992 |
|---|
| 1 | | J. S. Hwang:
Interference-free tool-path generation in the NC machining of parametric compound surfaces.
Computer-Aided Design 24(12): 667-676 (1992) |
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