 | 2008 |
|---|
| 6 |       | Chi-Chang Hsieh,
Wen-Huang Cheng,
Chia-Hu Chang,
Yung-Yu Chuang,
Ja-Ling Wu:
Photo navigator.
ACM Multimedia 2008: 419-428 |
| 5 | | Wen-Huang Cheng,
Yung-Yu Chuang,
Yin-Tzu Lin,
Chi-Chang Hsieh,
Shao-Yen Fang,
Bing-Yu Chen,
Ja-Ling Wu:
Semantic Analysis for Automatic Event Recognition and Segmentation of Wedding Ceremony Videos.
IEEE Trans. Circuits Syst. Video Techn. 18(11): 1639-1650 (2008) |
| 4 | | Chi-Hui Chien,
Thaiping Chen,
Wei-Bang Lin,
Chi-Chang Hsieh,
Yii-Der Wu,
Cheng-Hsiu Yeh:
Experimental and statistical study in adhesion features of bonded interfaces of IC packages.
Microelectronics Reliability 48(1): 140-148 (2008) |
| 2007 |
|---|
| 3 | | Wen-Huang Cheng,
Yung-Yu Chuang,
Bing-Yu Chen,
Ja-Ling Wu,
Shao-Yen Fang,
Yin-Tzu Lin,
Chi-Chang Hsieh,
Chen-Ming Pan,
Wei-Ta Chu,
Min-Chun Tien:
Semantic-event based analysis and segmentation of wedding ceremony videos.
Multimedia Information Retrieval 2007: 95-104 |
| 2006 |
|---|
| 2 | | Chi-Hui Chien,
Thaiping Chen,
Yung-Chang Chen,
Yii-Tay Chiou,
Chi-Chang Hsieh,
Yii-Der Wu:
Stability of the warpage in a PBGA package subjected to hygro-thermal loading.
Microelectronics Reliability 46(7): 1139-1147 (2006) |
| 2003 |
|---|
| 1 | | Chi-Hui Chien,
Yung-Chang Chen,
Yii-Tay Chiou,
Thaiping Chen,
Chi-Chang Hsieh,
Jia-Jin Yan,
Wei-Zhi Chen,
Yii-Der Wu:
Influences of the moisture absorption on PBGA package's warpage during IR reflow process.
Microelectronics Reliability 43(1): 131-139 (2003) |
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