Wei Hong II

	1996
2		Weikai Sun, Wayne Wei-Ming Dai, Wei Hong II: Fast Parameters Extraction of General Three-Dimension Interconnects Using Geometry Independent Measured Equation of Invariance. DAC 1996: 371-376
1		Wei Hong II, Weikai Sun, Zhenhai Zhu, Hao Ji, Ben Song, Wayne Wei-Ming Dai: A novel dimension reduction technique for the capacitance extraction of 3D VLSI interconnects. ICCAD 1996: 381-386

Coauthor Index

1	Wayne Wei-Ming Dai	[1] [2]
2	Hao Ji	[1]
3	Ben Song	[1]
4	Weikai Sun	[1] [2]
5	Zhenhai Zhu	[1]

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