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| 2009 | ||
|---|---|---|
| 2 | Hao Yu, Joanna Ho, Lei He: Allocating power ground vias in 3D ICs for simultaneous power and thermal integrity. ACM Trans. Design Autom. Electr. Syst. 14(3): (2009) | |
| 2006 | ||
| 1 | Hao Yu, Joanna Ho, Lei He: Simultaneous power and thermal integrity driven via stapling in 3D ICs. ICCAD 2006: 802-808 | |
| 1 | Lei He | [1] [2] |
| 2 | Hao Yu | [1] [2] |
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