J. Herrmann

	2001
1		D. Weber, F. Höhnsdorf, A. Hausmann, A. Klipp, Z. Stavreva, J. Herrmann, L. Bauch, M. Junack, H. Neef, M. Nichterwitz, S. Finsterbusch: Impact of substituting SiO2 ILD by low k materials into AlCu RIE metallization. Microelectronics Reliability 41(7): 1081-1083 (2001)

Coauthor Index

1	L. Bauch	[1]
2	S. Finsterbusch	[1]
3	A. Hausmann	[1]
4	F. Höhnsdorf	[1]
5	M. Junack	[1]
6	A. Klipp	[1]
7	H. Neef	[1]
8	M. Nichterwitz	[1]
9	Z. Stavreva	[1]
10	D. Weber	[1]

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