Zongjie Han

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2006

1 Songbai Xue, Yuxiu Wu, Zongjie Han, Ling Zhang: Effects of lead widths and pitches on reliability of soldered joints and optimum simulation for QFP devices. CGVR 2006: 168-174

	2006
1		Songbai Xue, Yuxiu Wu, Zongjie Han, Ling Zhang: Effects of lead widths and pitches on reliability of soldered joints and optimum simulation for QFP devices. CGVR 2006: 168-174

Coauthor Index

1 Yuxiu Wu [1]

2 Songbai Xue [1]

3 Ling Zhang [1]

Last update Thu May 31 18:55:10 2012 CET by the DBLP Team —

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