 | 2012 |
|---|
| 4 |       | Bong-Min Song,
Bongtae Han,
Avram Bar-Cohen,
Mehmet Arik,
Rajdeep Sharma,
Stan Weaver:
Life prediction of LED-based recess downlight cooled by synthetic jet.
Microelectronics Reliability 52(5): 937-948 (2012) |
| 2010 |
|---|
| 3 | | Changsoo Jang,
Byeng Dong Youn,
Ping F. Wang,
Bongtae Han,
Suk-Jin Ham:
Forward-stepwise regression analysis for fine leak batch testing of wafer-level hermetic MEMS packages.
Microelectronics Reliability 50(4): 507-513 (2010) |
| 2008 |
|---|
| 2 | | Arindam Goswami,
Bongtae Han:
On the applicability of MIL-Spec-based helium fine leak test to packages with sub-micro liter cavity volumes.
Microelectronics Reliability 48(11-12): 1815-1821 (2008) |
| 2005 |
|---|
| 1 | | Jinwon Joo,
Seungmin Cho,
Bongtae Han:
Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry.
Microelectronics Reliability 45(3-4): 637-646 (2005) |
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