![]() | ![]() |
| 2009 | ||
|---|---|---|
| 2 | M. Berthou, P. Retailleau, Hélène Frémont, A. Guédon-Gracia, C. Jéphos-Davennel: Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage. Microelectronics Reliability 49(9-11): 1267-1272 (2009) | |
| 2005 | ||
| 1 | A. Guédon-Gracia, E. Woirgard, C. Zardini: Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability. Microelectronics Reliability 45(9-11): 1652-1657 (2005) | |
| 1 | M. Berthou | [2] |
| 2 | Hélène Frémont | [2] |
| 3 | C. Jéphos-Davennel | [2] |
| 4 | P. Retailleau | [2] |
| 5 | Eric Woirgard (E. Woirgard) | [1] |
| 6 | C. Zardini | [1] |
Colors in the list of coauthors
Last update Fri Jun 1 15:44:53 2012 CET by the DBLP Team —
Data released under the ODC-BY 1.0 license — See also our legal information page