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| 2005 | ||
|---|---|---|
| 1 | Guotao Wang, Paul S. Ho, Steven Groothuis: Chip-packaging interaction: a critical concern for Cu/low k packaging. Microelectronics Reliability 45(7-8): 1079-1093 (2005) | |
| 1 | Paul S. Ho | [1] |
| 2 | Guotao Wang | [1] |
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