 | 2011 |
| 7 |  | Matthew Grange,
Axel Jantsch,
Roshan Weerasekera,
Dinesh Pamunuwa:
Modeling the computational efficiency of 2-D and 3-D silicon processors for early-chip planning.
ICCAD 2011: 310-317 |
| 6 |  | Matt Grange,
Roshan Weerasekera,
Dinesh Pamunuwa,
Axel Jantsch,
Awet Yemane Weldezion:
Optimal network architectures for minimizing average distance in k-ary n-dimensional mesh networks.
NOCS 2011: 57-64 |
| 5 |  | Dinesh Pamunuwa,
Matthew Grange,
Roshan Weerasekera,
Axel Jantsch:
3-D integration and the limits of silicon computation.
VLSI-SoC 2011: 343-348 |
| 2010 |
| 4 |  | Roshan Weerasekera,
Matt Grange,
Dinesh Pamunuwa,
Hannu Tenhunen:
On signalling over Through-Silicon Via (TSV) interconnects in 3-D Integrated Circuits.
DATE 2010: 1325-1328 |
| 2009 |
| 3 |  | Matt Grange,
Awet Yemane Weldezion,
Dinesh Pamunuwa,
Roshan Weerasekera,
Zhonghai Lu,
Axel Jantsch,
Dave Shippen:
Physical mapping and performance study of a multi-clock 3-Dimensional Network-on-Chip mesh.
3DIC 2009: 1-7 |
| 2 |  | Roshan Weerasekera,
Matt Grange,
Dinesh Pamunuwa,
Hannu Tenhunen,
Li-Rong Zheng:
Compact modelling of Through-Silicon Vias (TSVs) in three-dimensional (3-D) integrated circuits.
3DIC 2009: 1-8 |
| 1 |  | Awet Yemane Weldezion,
Matt Grange,
Dinesh Pamunuwa,
Zhonghai Lu,
Axel Jantsch,
Roshan Weerasekera,
Hannu Tenhunen:
Scalability of network-on-chip communication architecture for 3-D meshes.
NOCS 2009: 114-123 |