Juan Gomez

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2007

1 Cemal Basaran, Juan Gomez, Minghui Lin, Shidong Li: Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging. SCSC 2007: 269-275

	2007
1		Cemal Basaran, Juan Gomez, Minghui Lin, Shidong Li: Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging. SCSC 2007: 269-275

Coauthor Index

1 Cemal Basaran [1]

2 Shidong Li [1]

3 Minghui Lin [1]

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