 | 2008 |
|---|
| 6 |       | S. Bendida,
J. J. Koning,
J. J. M. Bontemps,
J. T. M. van Beek,
D. Wu,
M. A. J. van Gils,
S. Nath:
Temperature stability of a piezoresistive MEMS resonator including self-heating.
Microelectronics Reliability 48(8-9): 1227-1231 (2008) |
| 2007 |
|---|
| 5 | | Olaf van der Sluis,
R. A. B. Engelen,
Richard B. R. van Silfhout,
W. D. van Driel,
M. A. J. van Gils:
Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion.
Microelectronics Reliability 47(12): 1975-1982 (2007) |
| 4 | | M. A. J. van Gils,
Olaf van der Sluis,
G. Q. Zhang,
J. H. J. Janssen,
R. M. J. Voncken:
Analysis of Cu/low-k bond pad delamination by using a novel failure index.
Microelectronics Reliability 47(2-3): 179-186 (2007) |
| 3 | | W. D. van Driel,
A. Mavinkurve,
M. A. J. van Gils,
G. Q. Zhang:
Advanced structural similarity rules for the BGA package family.
Microelectronics Reliability 47(2-3): 205-214 (2007) |
| 2 | | M. A. J. van Gils,
W. D. van Driel,
G. Q. Zhang,
H. J. L. Bressers,
Richard B. R. van Silfhout,
X. J. Fan,
J. H. J. Janssen:
Virtual qualification of moisture induced failures of advanced packages.
Microelectronics Reliability 47(2-3): 273-279 (2007) |
| 2005 |
|---|
| 1 | | W. D. van Driel,
M. A. J. van Gils,
Richard B. R. van Silfhout,
G. Q. Zhang:
Prediction of Delamination Related IC & Packaging Reliability Problems.
Microelectronics Reliability 45(9-11): 1633-1638 (2005) |
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