E. G. Gebreselasie

	2008
1		A. J. Joseph, J. D. Gillis, M. Doherty, P. J. Lindgren, R. A. Previti-Kelly, R. M. Malladi, P.-C. Wang, M. Erturk, H. Ding, E. G. Gebreselasie, M. J. McPartlin, J. Dunn: Through-silicon vias enable next-generation SiGe power amplifiers for wireless communications. IBM Journal of Research and Development 52(6): 635-648 (2008)

Coauthor Index

1	H. Ding	[1]
2	M. Doherty	[1]
3	J. Dunn	[1]
4	M. Erturk	[1]
5	J. D. Gillis	[1]
6	A. J. Joseph	[1]
7	P. J. Lindgren	[1]
8	R. M. Malladi	[1]
9	M. J. McPartlin	[1]
10	R. A. Previti-Kelly	[1]
11	P.-C. Wang	[1]

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