Chee Lip Gan

	2007
3		Syed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel: Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations. Microelectronics Journal 38(4-5): 463-473 (2007)
	2005
2		Syed M. Alam, Frank L. Wei, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel: Electromigration Reliability Comparison of Cu and Al Interconnects. ISQED 2005: 303-308
	2004
1		Syed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel: Circuit Level Reliability Analysis of Cu Interconnects. ISQED 2004: 238-243

Coauthor Index

1	Syed M. Alam	[1] [2] [3]
2	Carl V. Thompson	[1] [2] [3]
3	Donald E. Troxel	[1] [2] [3]
4	Frank L. Wei	[2]

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