Takafumi Fukushima

	2011
13		Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi: Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration. Micromachines 2(1): 49-68 (2011)
	2010
12		Kouji Kiyoyama, Kang Wook Lee, Takafumi Fukushima, H. Naganuma, Hiroaki Kobayashi, Tetsu Tanaka, Mitsumasa Koyanagi: A block-parallel signal processing system for CMOS image sensor with three-dimensional structure. 3DIC 2010: 1-4
11		Akihiro Noriki, Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi: Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI. 3DIC 2010: 1-4
10		Takafumi Fukushima, Eiji Iwata, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi: Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature. 3DIC 2010: 1-5
9		Mariappan Murugesan, Yuki Ohara, Jichoel Bea, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi: Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding. 3DIC 2010: 1-5
8		Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka: Three-dimensional integration technology using through-si via based on reconfigured wafer-to-wafer bonding. CICC 2010: 1-4
	2009
7		Kouji Kiyoyama, Yuki Ohara, Kang Wook Lee, Y. Yang, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi: A parallel ADC for high-speed CMOS image processing system with 3D structure. 3DIC 2009: 1-4
6		Takafumi Fukushima, Eiji Iwata, Tetsu Tanaka, Mitsumasa Koyanagi: Development of a new self-assembled die bonder to three-dimensionally stack known good dies in batch. 3DIC 2009: 1-4
5		Ji Chel Bea, Mariappan Murugesan, Yuki Ohara, Akihiro Noriki, Hisaski Kino, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi: Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration. 3DIC 2009: 1-5
4		Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma, Kang Wook Lee, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi: 10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack. 3DIC 2009: 1-6
3		Kang Wook Lee, Shigeyuki Kanno, Yuki Ohara, Kouji Kiyoyama, Ji Chel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi: Heterogeneous integration technology for MEMS-LSI multi-chip module. 3DIC 2009: 1-6
2		Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka: Three-dimensional integration technology and integrated systems. ASP-DAC 2009: 409-415
	2005
1		Takeaki Sugimura, Yuta Konishi, Yoshihiro Nakatani, Takafumi Fukushima, Hiroyuki Kurino, Mitsumasa Koyanagi: Dynamic Multi-Context Reconfiguration Scheme for Reconfigurable Parallel Image Processing System with Three Dimensional Structure. ARCS Workshops 2005: 27-32

Coauthor Index

1	Ji Chel Bea	[3] [5] [13]
2	Jichoel Bea	[4] [9] [10] [11]
3	Eiji Iwata	[6] [10] [13]
4	Shigeyuki Kanno	[3]
5	Hisaski Kino	[5]
6	Kouji Kiyoyama	[3] [7] [12]
7	Hiroaki Kobayashi	[12]
8	Risato Kobayashi	[13]
9	Toshiya Kojima	[13]
10	Yuta Konishi	[1]
11	Takayuki Konno	[13]
12	Mitsumasa Koyanagi	[1] [2] [3] [4] [5] [6] [7] [8] [9] [10] [11] [12] [13]
13	Hiroyuki Kurino	[1]
14	Kang Wook Lee	[3] [4] [5] [7] [9] [10] [11] [12] [13]
15	Mariappan Murugesan	[4] [5] [9] [10] [13]
16	H. Naganuma	[12]
17	Yoshihiro Nakatani	[1]
18	Akihiro Noriki	[4] [5] [11]
19	Yuki Ohara	[3] [4] [5] [7] [9]
20	Katsuyuki Sakuma	[4]
21	Takeaki Sugimura	[1]
22	Tetsu Tanaka	[2] [3] [4] [5] [6] [7] [8] [9] [10] [11] [12] [13]
23	Fumiaki Yamada	[4]
24	Y. Yang	[7]

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