J. P. Fradin

	2007
4		P. Solomalala, J. Saiz, Michel Mermet-Guyennet, Alberto Castellazzi, Mauro Ciappa, X. Chauffleur, J. P. Fradin: Virtual reliability assessment of integrated power switches based on multi-domain simulation approach. Microelectronics Reliability 47(9-11): 1343-1348 (2007)
	2005
3		B. Khong, P. Tounsi, Ph. Dupuy, X. Chauffleur, M. Legros, A. Deram, C. Levade, G. Vanderschaeve, J. M. Dorkel, J. P. Fradin: Innovative Methodology for Predictive Reliability of Intelligent Power Devices Using Extreme Electro-thermal Fatigue. Microelectronics Reliability 45(9-11): 1717-1722 (2005)
	2001
2		Felix Beaudoin, X. Chauffleur, J. P. Fradin, Philippe Perdu, Romain Desplats, Dean Lewis: Modeling Thermal Laser Stimulation. Microelectronics Reliability 41(9-10): 1477-1482 (2001)
	1997
1		J. P. Fradin, L. Molla, B. Desaunettes: Analysis of 3D conjugate heat transfers in electronics. ED&TC 1997: 190-194

Coauthor Index

1	Felix Beaudoin	[2]
2	Alberto Castellazzi	[4]
3	X. Chauffleur	[2] [3] [4]
4	Mauro Ciappa	[4]
5	A. Deram	[3]
6	B. Desaunettes	[1]
7	Romain Desplats	[2]
8	J. M. Dorkel	[3]
9	Ph. Dupuy	[3]
10	B. Khong	[3]
11	M. Legros	[3]
12	C. Levade	[3]
13	Dean Lewis	[2]
14	Michel Mermet-Guyennet	[4]
15	L. Molla	[1]
16	Philippe Perdu	[2]
17	J. Saiz	[4]
18	P. Solomalala	[4]
19	P. Tounsi	[3]
20	G. Vanderschaeve	[3]

Colors in the list of coauthors

Last update Wed May 30 22:34:44 2012 CET by the DBLP Team — Data released under the ODC-BY 1.0 license — See also our legal information page