 | 2011 |
| 13 |  | A. Aubert,
S. Jacques,
S. Pétremont,
Nathalie Labat,
Hélène Frémont:
Experimental power cycling on insulated TRIAC package: Reliability interpretation thanks to an innovative failure analysis flow.
Microelectronics Reliability 51(9-11): 1845-1849 (2011) |
| 12 |  | Lutz Meinshausen,
Kirsten Weide-Zaage,
Hélène Frémont:
Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps.
Microelectronics Reliability 51(9-11): 1860-1864 (2011) |
| 2010 |
| 11 |  | Xiaosong Ma,
Kaspar M. B. Jansen,
G. Q. Zhang,
Willem D. van Driel,
Olaf van der Sluis,
Leo J. Ernst,
C. Regards,
Christian Gautier,
Hélène Frémont:
A fast moisture sensitivity level qualification method.
Microelectronics Reliability 50(9-11): 1654-1660 (2010) |
| 10 |  | A. Aubert,
J. P. Rebrasse,
L. Dantas de Morais,
Nathalie Labat,
Hélène Frémont:
Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing.
Microelectronics Reliability 50(9-11): 1688-1691 (2010) |
| 9 |  | Pascal Lecuyer,
Hélène Frémont,
Jean-Pierre Landesman,
Manoubi Auguste Bahi:
Wearout estimation using the Robustness Validation methodology for components in 150 degreeC ambient automotive applications.
Microelectronics Reliability 50(9-11): 1744-1749 (2010) |
| 2009 |
| 8 |  | M. Berthou,
P. Retailleau,
Hélène Frémont,
A. Guédon-Gracia,
C. Jéphos-Davennel:
Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage.
Microelectronics Reliability 49(9-11): 1267-1272 (2009) |
| 7 |  | Manoubi Auguste Bahi,
Hélène Frémont,
Jean-Pierre Landesman,
Annabelle Gentil,
Pascal Lecuyer:
A new methodology for the identification of ball bond degradation during high-temperature aging tests on devices in standard plastic packages.
Microelectronics Reliability 49(9-11): 1273-1277 (2009) |
| 6 |  | Charles Regard,
Christian Gautier,
Hélène Frémont,
Patrick Poirier,
Xiaosong Ma,
Kaspar M. B. Jansen:
Fast reliability qualification of SiP products.
Microelectronics Reliability 49(9-11): 958-962 (2009) |
| 2007 |
| 5 |  | Kirsten Weide-Zaage,
David Dalleau,
Yves Danto,
Hélène Frémont:
Dynamic void formation in a DD-copper-structure with different metallization geometry.
Microelectronics Reliability 47(2-3): 319-325 (2007) |
| 4 |  | W. C. Maia Filho,
M. Brizoux,
Hélène Frémont,
Yves Danto:
Torsion test applied for reballing and solder paste volume evaluation.
Microelectronics Reliability 47(9-11): 1663-1667 (2007) |
| 3 |  | Manoubi Auguste Bahi,
Pascal Lecuyer,
Hélène Frémont,
Jean-Pierre Landesman:
Sequential environmental stresses tests qualification for automotive components.
Microelectronics Reliability 47(9-11): 1680-1684 (2007) |
| 2006 |
| 2 |  | W. C. Maia Filho,
M. Brizoux,
Hélène Frémont,
Yves Danto:
Improved physical understanding of intermittent failure in continuous monitoring method.
Microelectronics Reliability 46(9-11): 1886-1891 (2006) |
| 2005 |
| 1 |  | Kirsten Weide-Zaage,
Walter Horaud,
Hélène Frémont:
Moisture diffusion in Printed Circuit Boards: Measurements and Finite- Element- Simulations.
Microelectronics Reliability 45(9-11): 1662-1667 (2005) |