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Hélène Frémont Coauthor index pubzone.org

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13Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLA. Aubert, S. Jacques, S. Pétremont, Nathalie Labat, Hélène Frémont: Experimental power cycling on insulated TRIAC package: Reliability interpretation thanks to an innovative failure analysis flow. Microelectronics Reliability 51(9-11): 1845-1849 (2011)
12Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLLutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont: Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps. Microelectronics Reliability 51(9-11): 1860-1864 (2011)
2010
11Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLXiaosong Ma, Kaspar M. B. Jansen, G. Q. Zhang, Willem D. van Driel, Olaf van der Sluis, Leo J. Ernst, C. Regards, Christian Gautier, Hélène Frémont: A fast moisture sensitivity level qualification method. Microelectronics Reliability 50(9-11): 1654-1660 (2010)
10Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLA. Aubert, J. P. Rebrasse, L. Dantas de Morais, Nathalie Labat, Hélène Frémont: Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing. Microelectronics Reliability 50(9-11): 1688-1691 (2010)
9Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLPascal Lecuyer, Hélène Frémont, Jean-Pierre Landesman, Manoubi Auguste Bahi: Wearout estimation using the Robustness Validation methodology for components in 150 degreeC ambient automotive applications. Microelectronics Reliability 50(9-11): 1744-1749 (2010)
2009
8Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLM. Berthou, P. Retailleau, Hélène Frémont, A. Guédon-Gracia, C. Jéphos-Davennel: Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage. Microelectronics Reliability 49(9-11): 1267-1272 (2009)
7Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLManoubi Auguste Bahi, Hélène Frémont, Jean-Pierre Landesman, Annabelle Gentil, Pascal Lecuyer: A new methodology for the identification of ball bond degradation during high-temperature aging tests on devices in standard plastic packages. Microelectronics Reliability 49(9-11): 1273-1277 (2009)
6Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLCharles Regard, Christian Gautier, Hélène Frémont, Patrick Poirier, Xiaosong Ma, Kaspar M. B. Jansen: Fast reliability qualification of SiP products. Microelectronics Reliability 49(9-11): 958-962 (2009)
2007
5Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLKirsten Weide-Zaage, David Dalleau, Yves Danto, Hélène Frémont: Dynamic void formation in a DD-copper-structure with different metallization geometry. Microelectronics Reliability 47(2-3): 319-325 (2007)
4Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLW. C. Maia Filho, M. Brizoux, Hélène Frémont, Yves Danto: Torsion test applied for reballing and solder paste volume evaluation. Microelectronics Reliability 47(9-11): 1663-1667 (2007)
3Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLManoubi Auguste Bahi, Pascal Lecuyer, Hélène Frémont, Jean-Pierre Landesman: Sequential environmental stresses tests qualification for automotive components. Microelectronics Reliability 47(9-11): 1680-1684 (2007)
2006
2Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLW. C. Maia Filho, M. Brizoux, Hélène Frémont, Yves Danto: Improved physical understanding of intermittent failure in continuous monitoring method. Microelectronics Reliability 46(9-11): 1886-1891 (2006)
2005
1Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLKirsten Weide-Zaage, Walter Horaud, Hélène Frémont: Moisture diffusion in Printed Circuit Boards: Measurements and Finite- Element- Simulations. Microelectronics Reliability 45(9-11): 1662-1667 (2005)

Coauthor Index

1A. Aubert [10] [13]
2Manoubi Auguste Bahi [3] [7] [9]
3M. Berthou [8]
4M. Brizoux [2] [4]
5David Dalleau [5]
6Yves Danto (Y. Danto) [2] [4] [5]
7Willem D. van Driel (W. D. van Driel) [11]
8Leo J. Ernst (L. J. Ernst) [11]
9W. C. Maia Filho [2] [4]
10Christian Gautier [6] [11]
11Annabelle Gentil [7]
12A. Guédon-Gracia [8]
13Walter Horaud [1]
14S. Jacques [13]
15Kaspar M. B. Jansen [6] [11]
16C. Jéphos-Davennel [8]
17Nathalie Labat [10] [13]
18Jean-Pierre Landesman [3] [7] [9]
19Pascal Lecuyer [3] [7] [9]
20Xiaosong Ma [6] [11]
21Lutz Meinshausen [12]
22L. Dantas de Morais [10]
23S. Pétremont [13]
24Patrick Poirier [6]
25J. P. Rebrasse [10]
26Charles Regard [6]
27C. Regards [11]
28P. Retailleau [8]
29Olaf van der Sluis [11]
30Kirsten Weide-Zaage [1] [5] [12]
31G. Q. Zhang (G. Q. (Kouchi) Zhang) [11]

Colors in the list of coauthors

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