P. D. Foo

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2003

2 Y. S. Zheng, Q. Guo, Y. J. Su, P. D. Foo: Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration. Microelectronics Journal 34(2): 109-113 (2003)

1 Y. S. Zheng, Y. J. Su, B. Yu, P. D. Foo: Investigation of defect on copper bond pad surface in copper/low k process integration. Microelectronics Reliability 43(8): 1311-1316 (2003)

	2003
2		Y. S. Zheng, Q. Guo, Y. J. Su, P. D. Foo: Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration. Microelectronics Journal 34(2): 109-113 (2003)
1		Y. S. Zheng, Y. J. Su, B. Yu, P. D. Foo: Investigation of defect on copper bond pad surface in copper/low k process integration. Microelectronics Reliability 43(8): 1311-1316 (2003)

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