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| 2007 | ||
|---|---|---|
| 3 | Andrzej Dziedzic, Jan Felba: Polytronic 2005. Microelectronics Reliability 47(2-3): 327 (2007) | |
| 2 | Ryszard Kisiel, Jan Felba, Janusz Borecki, Andrzej Moscicki: Problems of PCB microvias filling by conductive paste. Microelectronics Reliability 47(2-3): 335-341 (2007) | |
| 2005 | ||
| 1 | Ryszard Kisiel, Janusz Borecki, Grazyna Koziol, Jan Felba: Conductive adhesives for through holes and blind vias metallization. Microelectronics Reliability 45(12): 1935-1940 (2005) | |
| 1 | Janusz Borecki | [1] [2] |
| 2 | Andrzej Dziedzic | [3] |
| 3 | Ryszard Kisiel | [1] [2] |
| 4 | Grazyna Koziol | [1] |
| 5 | Andrzej Moscicki | [2] |
Colors in the list of coauthors
Last update Wed May 30 22:34:44 2012 CET by the DBLP Team —
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