 | 2012 |
| 6 |  | Patrick Le Maitre,
Melanie Brocard,
Alexis Farcy,
Jean-Claude Marin:
Device and electromagnetic co-simulation of TSV: Substrate noise study and compact modeling of a TSV in a matrix.
ISQED 2012: 404-411 |
| 2009 |
| 5 |  | Patrick Leduc,
Myriam Assous,
Léa Di Cioccio,
Marc Zussy,
Thomas Signamarcheix,
Antonio Roman,
Maxime Rousseau,
Sophie Verrun,
Laurent Bally,
David Bouchu,
Lionel Cadix,
Alexis Farcy,
Nicolas Sillon:
First integration of Cu TSV using die-to-wafer direct bonding and planarization.
3DIC 2009: 1-5 |
| 4 |  | Julie Roullard,
Stéphane Capraro,
Thierry Lacrevaz,
Lionel Cadix,
Elie Eid,
Alexis Farcy,
Bernard Fléchet:
Influence of 3D integration on 2D interconnections and 2D self inductors HF properties.
3DIC 2009: 1-6 |
| 3 |  | Elie Eid,
Thierry Lacrevaz,
Sébastien de Rivaz,
Cédric Bermond,
Bernard Fléchet,
Francis Calmon,
Christian Gontrand,
Alexis Farcy,
Lionel Cadix,
Pascal Ancey:
Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking.
3DIC 2009: 1-6 |
| 2 |  | Lionel Cadix,
Alexis Farcy,
Cédric Bermond,
Christine Fuchs,
Patrick Leduc,
Maxime Rousseau,
Myriam Assous,
Alexandre Valentian,
Julie Roullard,
Elie Eid,
Nicolas Sillon,
Bernard Fléchet,
Pascal Ancey:
Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits.
3DIC 2009: 1-7 |
| 2008 |
| 1 |  | Manuel Sellier,
Jean Michel Portal,
Bertrand Borot,
Steve Colquhoun,
Richard Ferrant,
Frédéric Boeuf,
Alexis Farcy:
Predictive Delay Evaluation on Emerging CMOS Technologies: A Simulation Framework.
ISQED 2008: 492-497 |